Chip-out Introduction
• When should one consider the Chip-out process
• Mobile Device Force Acquisition Continuum
• Supported devices
• Overview of real cases
• What you may encounter in Chip-out dumps

Chip-out Heat Process
• Disassembly of the cell phone and considerations
• References and training for cell phone disassembly
• Heat/Non-Heat shield removal
• Removing chip Upper/Lower heat source
• Removing chips Lower heat source
• Removing chip T862
• When to and not to use these heat chip removal/cleaning processes
• Preparing the chip for Tinning or 2 Stage Reballing
• Tinning of BGA chips
• Review of videos of each process

Characteristics of Flash Memory
• Types of Chip you will encounter and what is to come
• What is Flash Memory
• How is the data stored in the memory
• Wear Levelling-Garbage Collection-FTL-Trim and their affects
• Transition through NOR-NAND-eMMC-eMCP-UFS
• Controller functions related to Flash Memory
• Quick look at SSD type storageUP828 & UP828P Programmers
• Getting to know the software/hardware interface
• Installation process
• What are the differences between UP828 and UP828P
• Adapters and how they work
• Importance of the Checksum Hash values
• Errors you will encounter and how to trouble shoot them
• Quick look at decoding to data2 Stage Reballing of BGA Chips
• Tools and kit you will need
• Low heat solder paste
• Stage 1 reballing of the chip
• Overview of BGA Stencils
• Stage 2 reballing of the chip
• When and why to use each reballing stage
• Other options for Reballing

Non-Heat Milling BGA Chips
• Overview of the process and video
• The right and wrong equipment for this process
• Process where milling is best used
• Pros and Cons of the Milling process
• Some training locations will feature a Milling machine for use

Non-Heat Polishing Process
• Overview of the process
• Two reasons to use the Polishing Process
• Polishing surfaces – When and why to use them
• Polishing Fixtures – How to use them
• Adhesives – When to use what type
• Polishing epoxy only
• Polishing PCB with cut out chip
• Video review and discussion of each process

Medusa eMMC Box
• Overview of the Medusa Pro Box
• Installation process
• ISP-eMMC Functions

Alternative Reading Tools
• SD or USB eMMC type Adapters
• Advantages and when to use the eMMC SD adapters
• How to use them properly forensically
• E-Mate eMMC Pro kit
• Read through ISP Flasher Box
• Read through USB cable
• Bus Modes and how they can help
• In-System-programming direct solder to chip
• Other programmers for Mobile Phones
• Other programmers for Memory devices

Package on Package
• Reviewing phones that use POP chipsets
• Why is POP used
• Removing POP chips
• Splitting POP style chips
• Review Videos of the processes

Dediprog UFS Programmer
• A look at the UFS chips
• Understanding BGA95 and BGA153 differences
• Overview of the hardware and adapters
• Installation of the software
• LUN’s and other partitions in UFS style chips
• Looking at and reading the LUN’s and RPMB partitions
• Parsing out the recovered data

Resources and DataSheets
• Resources to help you with your Chip-out adventures
• Reference material
• Decoding the number on the chips
• How to find out what adapter you need
• How to find out what chip you have
• What can you glean from the chip datasheets
• Best/Safe places to get Datasheets

Certification Process
• Test phone provided to use any process from class
• Must provide instructor with bin dump and decoded data