ORDYL ® ALPHA 300is a negative, aqueous dry film specifically designed to have extremely high resistance in alkaline solutions and galvanic Nickel/ Gold. It can be exposed both with LDI and standard UV lamps. Alpha 300 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing. Ordyl Alpha 300 guarantee good adhesion on copper surface. This type of dry film has a good flexibility and ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.
40 μm (1.6 mils) and 50 μm (2mils) for standard application and Ni-Au Plating
75 μm (3 mils) for standard application, Ni-Au Plating and tin/leads stripping mask
Typical Application
Acid and alkaline etching
Tenting process
Copper, tin, tin/lead plating
Ni-Au Plating
Exposure
We recommend using UV lamps or laser source with emission peak at 360 – 380 nm. The following parameters are referred to: 7-9 Solid STEP of SST21 10-18 Solid STEP of RST25 The following parameters are referred to: 8 Solid STEP of SST21