ORDYL ® AM 100is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps. AM 100 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing. Ordyl AM 100 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.
Excellent through cure polymerization also with LDI exposure machine
Good adhesion properties
High Photospeed
High flexibility and conformability
Available Thickness
30 μm (1.2 mils), 40 μm (1.6 mils) and 50 μm (2 mils) for standard application
75 μm (3 mils) specific for Nickel and Gold plating
Typical Application
Acid and alkaline etching
Tenting process
Copper, tin, tin/lead plating
Nickel and Gold plating
Exposure
We recommend using UV lamps or laser source with emission peak at 360 – 405 nm. The following parameters are referred to: 6-9 Solid STEP of SST21 10-18 Solid STEP of RST25 The following parameters are referred to: 8 Solid STEP of SST21