Dry Films Suitable for 405nm Exposure

PRODUCT DESCRIPTION

ORDYL ® ALPHA 300 is a negative, aqueous dry film specifically designed to have extremely high resistance in alkaline solutions and galvanic Nickel/ Gold. It can be exposed both with LDI and standard UV lamps.

Alpha 300 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.

Ordyl Alpha 300 guarantee good adhesion on copper surface.

This type of dry film has a good flexibility and ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.

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Description

Main Features

Extreme resistance in alkaline solutions

High resistance in Ni-Au Plating

Typical Application

Acid and alkaline etching

Tenting process

Copper, tin, tin/lead plating

Ni-Au Plating

Available Thickness

30 μm (1.2 mils) for acid and alkaline etching

40 μm (1.6 mils) and 50 μm (2mils) for standard application and Ni-Au Plating

75 μm (3 mils) for standard application, Ni-Au Plating and tin/leads stripping mask

Exposure

We recommend using UV lamps or laser source with emission peak at 360 – 380 nm.

The following parameters are referred to:

7-9 Solid STEP of SST21

10-18 Solid STEP of RST25

The following parameters are referred to: 8 Solid STEP of SST21

	ALPHA 330	ALPHA 340	ALPHA 350	ALPHA 375
Energy (mJ/cm²)	40-60	50-70	80-100	100-120
Resolution	30 µm (1.2 mils)	40 µm (1.6 mils)	50 µm (2 mils)	75 µm (3 mils)

Developing (B.P. 60%)

	ALPHA 330	ALPHA 340	ALPHA 350	ALPHA 375
Developing time	40 sec.	55 sec.	75 sec.	120 sec.
Dry Film load 1g/l	0.03 m²/l	0.025 m²/l	0.017 m²/l	0.012 m²/l

We recommend a maximum Dry Film load of 3 g/l.

+971 50 465 5680

Product Details