PRODUCT DESCRIPTION

ORDYL ® AM 100 is a negative, aqueous processable dry film specifically designed to be exposed with LDI but usable also with standard UV lamps. AM 100 is developable and strippable in mildly alkaline solutions and offers superior performances and resistance to leaching in all the most commonly used plating bath in PCB manufacturing.

Ordyl AM 100 has good adhesion on copper surface and for this reason is indicated for direct plating process and in case of surface preparation is not good. This type of dry film ensure good tenting performances even on large tooling holes; this can be achieved starting from 40 μm thickness.